Semiconductor and Electronic Manufacturing Industry

release time:

2026-03-17

Through precise measurements of pressure, temperature, flow, liquid level, displacement, gas analysis, vacuum control, and more, they enable high-precision monitoring and stable control of high-purity process media, clean environments, and process parameters.

Core Features

Precision at the Physical Limit: Measurement accuracy typically reaches the nanometer, sub-nanometer, or even angstrom level, with extreme control over environmental temperature, humidity, vibration, cleanliness, and electromagnetic interference.

Exceptional Process Compatibility: Must adapt to ultra-clean, high-vacuum, and highly corrosive wafer fabrication environments, ensuring zero particle or metal contamination to meet advanced process requirements.

High Technical Barriers: High-end metrology and inspection equipment has long been monopolized by overseas players, representing a critical "choke point" in the semiconductor supply chain.

Key Application Areas

Wafer Process Metrology: Film thickness ellipsometers, critical dimension scanning electron microscopes (CD-SEM), defect inspection tools, and wafer flatness measurement systems to monitor yield in core processes like lithography, etching, and deposition.

Component Parameter Testing: Semiconductor parameter analyzers, probe stations, and high/low-temperature test systems for electrical performance testing and qualification screening of chips and discrete devices.

Environment and Process Control: Laser particle counters, electrostatic monitors, and precision temperature/humidity controllers to maintain stable conditions in Class 100/1000 cleanrooms and prevent yield loss due to contamination.

End-Assembly Inspection: AOI/AVI visual inspection systems, impedance testers, and flying probe testers to ensure assembly quality for PCBs and consumer electronics end products.

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Metallurgy and Non-Ferrous Metals Industry

No more

Metallurgy and Non-Ferrous Metals Industry